| Basic Properties |
Dielectric Thickness μm |
25 |
|
High Pot Withstand(DC) KV |
>6.0 |
100V/sec ramp |
High Pot Withstand(AC) KV |
>5.0 |
ASTM D149 |
High Pot Breakdown(AC) KV |
>4.0 |
ASTM D149 |
Dielectric Constant (1MHz) |
5.4 |
ASTM D150 |
Volume Resistivity ohm-cm |
10^15 |
ASTM D257 |
Surface Resistivity ohm |
10^12 |
ASTM D257 |
| Thermal Properties |
| Thermal Impedance °Cin2/W |
0.05 |
ASTM D5470 |
| Thermal Conductivity W/mK |
5 |
ASTM D5470 |
| Chemical Resistance |
Dielectric Strength Retention Rate% |
|
| Methylenechloride |
95% |
24hour 30°C |
| Chloroform |
88% |
24hour 30°C |
| Trichloroethylketone |
92% |
24hour 30°C |
| Xylene |
98% |
24hour 30°C |
| 10% HCI acid |
92% |
24hour 30°C |
| 10% Sulfuric acid |
93% |
24hour 30°C |
| 2% Sodium Hydroxide |
99% |
24hour 30°C |
| 10% Sodium Hydroxide |
85% |
24hour 30°C |
| Heat Resistance |
| Glass transition Temperature °C |
240 |
TMA |
| Thermal Decomposition Temperature |
>450 |
|
| Lead-free Solder @288°C |
>30min |
|
